Semicon 2.0 opens applications for three chip manufacturing tracks
India has opened Semicon 2.0 applications for chipmaking machinery and materials, new fabrication plants, and facilities that assemble, package or test chips.
The story in brief
The electronics ministry launched the portal on 6 November. A fabrication plant makes the chips themselves, while packaging and testing facilities prepare chips for use and check that they work. Both types of projects have an application track.1 The Cabinet approved ₹1,27,500 crore for the full six-part programme. India Semiconductor Mission will assess applications on technical and financial grounds and recommend which projects should receive support.12
Context: A business preparing a proposal should check the notification for its own track. The overall programme budget does not determine the support available to an individual project.2
Who this matters for: Chip manufacturers, equipment and materials suppliers
Not yet known
The launch release does not give closing dates for the three tracks.
Sources
- 1Semicon 2.0 web application portal launch ↗Ministry of Electronics and IT via PIB · 6 November 2026
- 2Semicon 2.0 scheme notifications and appraisal process ↗Ministry of Electronics and IT via PIB · 31 August 2026
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